Plasma etching is a surface treatment process in which substantial amount of material is impacted and removed. This leads to a deep structuring of the surface.
How it works
Highly energetic and reactive species produced from a process gas (Ex: O2) react with the surface material. As a result of this process, the materials at the surface are broken down to smaller, volatile molecules. The vacuum system removes these small molecules. The process can be modified by adding additional neutral (uncharged) molecules to the process.
Semiconductor Technology –
Plasma etching is the main process during the production process of integrated circuits
Medical/Biomedical technology –
The process allows the coating and joining of inert, biocompatible materials that wouldn’t usually stick together otherwise.